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Metal and Acrylic Laser Marking Machine in Pakistan with Cooling Mode Air Cooling
Product Details:
| Place of Origin: | China |
| Brand Name: | Chylaser |
| Certification: | CE, ISO,CCC |
Payment & Shipping Terms:
| Minimum Order Quantity: | 1 set |
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| Price: | $2,300.00/sets 1-9 sets |
| Payment Terms: | T/T, L/C, Cash |
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Detail Information |
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| Application: | Laser Marking | Working Accuracy: | 0.01mm, 0.01mm |
|---|---|---|---|
| Graphic Format Supported: | AI, PLT, DXF, BMP, Dst, Dwg, DXP | Laser Type: | Fiber Laser, IPG Raycus Fiber Laser |
| Condition: | New | CNC Or Not: | Yes |
| Cooling Mode: | Air Cooling | Control Software: | EZCAD |
| Laser Source Brand: | RAYCUS | Control System Brand: | Cypcut |
| Weight (KG): | 80 KG | Key Selling Points: | High Productivity, Sustainable |
| Warranty: | 2 Years, 2 Years | Applicable Industries: | Garment Shops, Building Material Shops, Manufacturing Plant, Machinery Repair Shops, Food & Beverage Factory, Home Use, Retail, Food Shop, Printing Shops, Construction Works , Food & Beverage Shops, Advertising Company |
| Marking Area: | 175mm*175mm, 300*300MM | Machinery Test Report: | Provided |
| Video Outgoing-inspection: | Provided | Warranty Of Core Components: | 2 Years |
| Core Components: | Laser Source, Laser Device, Galvonameter, Main Board | Mode Of Operation: | Continuous Wave |
| Configuration: | Bench-top | Feature: | Water-cooled |
| Product Name: | Laser Marking Machine | Applicable Material: | Metal Acrylic |
| After Warranty Service: | Spare Parts | ||
Product Description
FIBER LASER CUTTING MACHINE
LASER WELDING MACHINE
CO2 CUTTING ENGRAVING MACHINE
LASER CLEANING MACHINE
LASER MARKING MACHINE
PIPE LASER CUTTING MACHINE
laser marking machine
Specification
Laser marking machine is widely used in food, medicine, cusmetics, wire, iron plate, machine parts, stainless steel plate, electrical appliances, electronic components, circuit boards and other materials packaging bottles surface marking, microporous Flexible PCB board, LCD, TFT marking, dicing cutting and other metal or non-metal plating removal, silicon wafer micro-hole, blindhole processing.
Performance /model | Unit | ||||
laser power | w | 20 30 50 60 100 120 200 | 3 5 10 15 20 | ||
Wavelength | nm | 1064 | 355 | ||
Min.character | mm | 0.15 | 0.15 | ||
Min. Linewidth | mm | 士0.002 | ±0.002 | ||
Beam quality | M2 | <1.2 | <1.2 | ||
Modulation Fre . | kHz | 1~30 | |||
Marking Scope | mm | 110×110/175 ×175 /300×300 | |||
Cooling way | Water cooling or air cooling | ||||
Power supplied | 220V ±5%/ 50Hz /10A | ||||
Assembling
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